SMT外观检查-外观检验规范,测试.ppt

理想狀況(TARGET CONDITION) DIP2-6 零件組裝標準--﹝CONNECTOR 、HEATSINK﹞浮件、傾斜(次缺-Minor) 允收狀況(ACCEPTABLE CONDITION) 拒收狀況(NONCONFORMING DEFECT) Lh、Wh 0.8mm Lh、Wh≦ 0.8mm DIP 外 觀 檢 驗 規 範 PAGE 6 1. 機構零件基座平貼PCB零件面 ，無浮高傾斜。 Component is mounted on M/B closely and no tilt or floating phenomenon. 1.浮高、傾斜小於0.8mm內。 ( Lh .Wh≦0.8mm ) 2.錫面零件腳出孔。 1.Dimension LH .Wh is less than 0.8mm. 2.Lead is protruded over solder. 1.浮高、傾斜大於0.8mm內判定拒收。( Lh . Wh 0.8mm ) 2.錫面零件腳未出孔判定拒收 。 1.Dimension LH . Wh is over than 0.8mm. 2.Lead isn’t protruded over solder. PCB CONNECTOR 理想狀況(TARGET CONDITION) DIP2-